PWA is a white calcined alumina abrasive powder consisting of plate-shaped crystals of aluminum oxide (Al2O3) with a purity of over 99.0%.The surface of the abrasive particles of platelet calcined alumina is flat and smooth. And the diameter-to-thickness ratio of the particles can be adjusted by adjusting the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches.
Chemical composition
| Chemical | Guarantee Value | Typical Value |
| Al2O3 | ≥99.0% | 99.36% |
| SiO2 | ＜0.2% | 0.017% |
| Fe2O3 | ＜0.1% | 0.03% |
| Na2O | ＜0.6% | 0.35% |
Physical properties
| Material | α-Al2O3 |
| Color | White |
| Specific gravity | ≥3.9g/cm3 |
| Mohs’Hardness | 9.0 |
| Type | D3(um) | D50（um） | D94（um） |
| CA45 | 50.5-56.2 | 33-38.5 | 20.7-24.5 |
| CA40 | 39-44.6 | 27.7-31.7 | 18-20 |
| CA35 | 35.4-39.8 | 23.8-27.2 | 15-17 |
| CA30 | 28.1-32.3 | 19.2-22.3 | 13.4-15.6 |
| CA25 | 24.4-28.2 | 16.1-18.7 | 9.6-11.2 |
| CA20 | 20.9-24.1 | 13.1-15.3 | 8.2-9.8 |
| CA15 | 14.8-17.2 | 9.4-11 | 5.8-6.8 |
| CA12 | 11.8-13.8 | 7.6-8.8 | 4.5-5.3 |
| CA09 | 8.9-10.5 | 5.9-6.9 | 3.3-3.9 |
| CA05 | 6.6-7.8 | 4.3-5.1 | 2.55-3.05 |
| CA03 | 4.8-5.6 | 2.8-3.4 | 1.5-2.1 |
Application:
1) Electronics industry: grinding and polishing of semiconductor monocrystalline silicon wafers, quartz quartz crystals, compound semiconductors (crystalline gallium, phosphating nano).
2) Glass industry: grinding and processing of crystal, quartz glass, kinescope glass shell screen, optical glass, liquid crystal display (LCD) glass substrate, and quartz crystal.
3) Coating industry: special coatings and fillers for plasma spraying.
4) Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-grade high-temperature coatings, etc.
Package:
